Ultrathin rigid circuit board manufacturing solutions
1. Basic properties of PCB products：
Project Name：Ultrathin Rigid PCB
Project function type：Component carrier
The core base material：FR4、BT ceramic etc
Auxiliary materials：Material specification：/
Min thickness：0.1mm Min hole：0.2mm
Min trace：3mil Min sapcing：3mil
Insulation resistance welding：Thermosetting/
photosensitive ink (multiple colors)
silk technology：Multicolor character ink stack-up：/
Special packaging：BGA、COB etc.
Surface treatment：ENIG、Pltaed gold、HASL、OSP etc.
2. Special manufacturing technology of PCB products:
Materials technology：Thin rigid circuit board is often used with small shrinkage coefficient, high hardness, warping deformation coefficient, low moisture absorption rate of materials; Some ultra-thin circuit boards need to choose materials with controllable dielectric constant, loss factor and other electrical performance indicators.
Manufacturing technology：Drilling, copper precipitation, electroplating, etching, molding and other processes often need to use the flexible circuit board manufacturing process control to complete;Prevent warping and deformation of ultra-thin circuit board, hollow out and no circuit empty area adopt isolated copper paving design, and mesh design for process edge
3. Circuit board product microelectronics technology:
Materials technology：Part of the ultra-thin rigid circuit board needs to control no trace of the line, must use special ink and printing coating process; Part of the ultra-thin rigid circuit board needs to guarantee the shape, size, surface technology and insulation bridge of the special package;
Manufacturing technology：Part of the ultra-thin rigid circuit board requires the same surface of a variety of surface processes, the same surface of a variety of insulation materials; Some ultra-thin rigid circuit boards require special surface processes, such as nickel palladium gold.
4. Circuit board product hardware electronics technology：
Most of the ultra-thin rigid circuit boards act as the support carrier of components/circuit connections in the technical environment of electronic circuit hardware;
A few ultra-thin rigid circuit boards can be used as LCR devices (such as variable carbon-oil bridge resistors, parallel plate capacitors, coil inductors, etc.);
Some ultra-thin rigid circuit boards use differential circuit design to simulate MESH safety circuit.
5. PCB product manufacturing and production control:
Core manufacturing processes: drilling, electroplating production control warping deformation;
Core QC engineering procedures: inspection of substrate material IQC, first inspection after line etching, first inspection after surface technology;
Finished product functional test: circuit open and short circuit functional test;Some products need to test the functional fixture of analog circuit;Line defect functional test;
Reliability test of finished products: optional salt spray test;Thermal shock test, weldability test, etc.
Product certification: 3C certification, UL certification, etc.
6. Product design available from Sunshine Good electronics:
Can provide electronic circuit schematic design, PCB wiring design, functional test fixture design;
Can provide manufacturability design, PCB-CAM design.
Sunshine Good service: hardware design, Schematic design, PCB layout, CAM design, Functional fixture design
7. Product application:
Independent microelectronic product substrate (SD card, SIM card, etc.), other IC boards, etc.