Volume production of microwave circuit assemblies requires fast, reliable and effi cient methods of attaching discrete microwave components to the circuit board.
5）4 layers Rogers 4003 with 1.2 mm thickness and 2 OZ immersion gold 2U”
Material: Rogers 4003 Pcb
Board size: 135*189mm
Surface finish: Immersion gold
Copper Weight: 2/2/2/2OZ
Solder mask: Green
Silk Screen: White
Min. Line Spacing: 0.1mm(4mil)
Min. Line Width: 0.1mm(4mil)
Raw material: American(original)
Testing Service: Flying probe ,Test jig(fixture)
Rogers 4003C pcb material in stock:
Rogers4003C: thickness(0.254 0.508、0.813、1.524) DK 3.38
Rogers4350B: thickness(0.254 0.508、0.762、1.524) DK 3.5
Rogers5880: thickness(0.254 0.508、0.762) DK 2.2
Rogers3003: thickness(0.127,0.508、0.762、1.524) DK 3
Rogers3010: thickness(0.635) DK 10.2
Rogers3206: thickness(0.635) DK 10.2
Rogers3035: thickness(0.508) DK 3.5
Rogers6010: thickness(0.635,1.27) DK 10.2
Rogers 4003C knowledge:
Volume production of microwave circuit assemblies requires fast, reliable and effi cient methods of attaching discrete microwave components to the circuit board. These could include simple two-lead devices such as resistors or diodes, or complex multi-lead MICs. Bonding techniques used for conventional epoxy glass grade laminates have been used with limited success on PTFE based laminates. However, conventional epoxy glass grade parameters are generally acceptable for the Rogers RO4000® series high frequency laminates. This application note is intended to present a general guide for device attachment to RT/duroid® and RO4000 high frequency laminates.
RT/duroid Laminate Characteristics RT/duroid laminates are random glass fi ber reinforced PTFE or ceramic fi lled PTFE materials. PTFE is a soft, waxy, thermoplastic fl uoropolymer. The glass or ceramic reinforcement adds dimensional stability and increases the hardness but the laminates are, in general, much softer than the low frequency hardboards, such as glass/epoxy. PTFE is a thermoplastic rather than a thermosetting resin. At elevated temperatures the substrate will readily deform and take a permanent set. Lead attachment methods must therefore minimize the pressure applied to the dielectric, particularly at elevated temperatures.
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