Key Specifications/Special Features: Key specifications: MOQ: 1pc Layers: 8L Material: FR-4 TG180 Surface: ENIG+ gold finger 30U" Soldermask: green PCB thickness: 1.6mm Min hole size: 0.15mm Minimum line width/space: 3/3mil Impedance tolerance: ±10% Shipping Information: FOB Port: Shenzhen Lead...
Key specifications:
MOQ: 1pc
Layers: 8L
Material: FR-4 TG180
Surface: ENIG+ gold finger 30U"
Soldermask: green
PCB thickness: 1.6mm
Min hole size: 0.15mm
Minimum line width/space: 3/3mil
Impedance tolerance: ±10%
FOB Port:Shenzhen
Lead Time:4 - 15 days
Dimensions per Unit:15 × 10 × 5 Centimeters
Weight per Unit:15 Kilograms
Units per Export Carton:500
Export Carton Dimensions L/W/H:33 × 23 × 20 Centimeters
Export Carton Weight:150 Grams
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