Key Specifications FR4(Tg170) material， 1.60mm thick, 1 OZ finished copper on all layers, ENIG surface finish, Green solder mask, Copper fill by VCP process, Min w/s(line width/spacing) 3.0/3.0 mil, Min BGA pad 0.25mm, Min mechanical drill bit 0.20mm Main Export Markets: Asia Australasia North...
FR4(Tg170) material，
1.60mm thick,
1 OZ finished copper on all layers,
ENIG surface finish,
Green solder mask,
Copper fill by VCP process,
Min w/s(line width/spacing) 3.0/3.0 mil,
Min BGA pad 0.25mm,
Min mechanical drill bit 0.20mm
Asia
Australasia
North America
Western Europe
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