16 layers multilayer PCB with 3.0mm thickness finished and plated gold board
5）16 layers multilayer PCB with 3.0mm thickness finished and plated gold board
Layer: 16 layers
Dimension: 422*855 mm
Track/Spacing: 4/4 mil
Surface Finish: Immersion Gold
Material: FR-4
Thickness: 3.0 mm
Features: FR-4 + High Frequency Hybrid Lamination
PCB Prototype Capability
Specification | Standard Specification | Customized Specification |
Layers | 1-12 Layer | 1-40 Layer |
Material | fr-4 | Rogers, Normal Tg FR4, Normal Tg FR4 (Halogen Free), High CTI, High Tg FR4, Ceramic Filled High-frequency Material, PTFE High-frequency Material, Hybrid Material |
Thickness | 0.8-1.6mm | 0.2-6.0mm |
Copper Weight | 35μm | 0.5oz-14oz |
Trace/Spacing | 6mil | 2mil |
Min. Hole Size | 0.3mm | 0.1mm |
Delivery Time | 4 Days (Double-sided) | 1 Day (Double-sided) |
Surface Finish | HASL/ HASL Lead Free | Immersion Gold, Hard Gold Plating (Ni/ Ni Free), Gold Finger, HASL, OSP, ENEPIG, Soft Gold Plating (Ni/ Ni Free), Immersion Sliver, Immersion Tin, ENIG+OSP, ENIG+G/F, Gold Plating+G/F, Immersion Tin+G/F |
Test Standard/Certificate | IPC-A-600H | IPC-A-600H \IPC-A-610E \GB4588ISO9001,ISO14001,UL,TS16949,OHSAS18001,CQC,GJB9001 |
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