FR 4 high TG PCB red soldermask 3 microinch gold

FR 4 High Tg PCB Red Solder Mask 3 Microinch Gold For System Integration

Product Details

FR 4 High Tg PCB Red Solder Mask 3 Microinch Gold For System Integration

 4-High Tg PCBs6847.jpg


Detailed Product Description

CCL: SHengyi

Tg Value: 170C

Layer Count: 4 Layers

Copper Weight: 0.5 Oz

PCB Thickness: 0.4mm +/-0.1

Solder Mask: Red

Surface Finish:ENIG

Via: Via In Pad. Tented


Advantages

a) Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃

b) Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.

c) Meeting your printed circuit board needs from PCB prototyping to mass volume production.

d) No minimum order quantity. 1-10 pieces are offered for sale.


More Applications in Electronics

Gateway

Rfid

Inverter

Antenna

Wifi Booster

Contract Manufacturing Services

Low Cost Plc

Embedded Systems Development

Embedded Computer Systems

Ac Power Supplies


IT-180 Data Sheets (Properties)

ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS

IPC-4101C Spec / 99 / 101 / 126

LAMINATE( IT-180ATC)

Property

Thickness<0.50 mm

Thickness≧0.50 mm

Units

Test Method

[0.0197 in]

[0.0197 in]

Typical Value

Spec

Typical Value

Spec

Metric

IPC-TM-650

(English)

(or as noted)

Peel Strength, minimum

 

 

 

 

N/mm

2.4.8

A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil]

 

 

 

 

(lb/inch)

2.4.8.2

B. Standard profile copper foil

0.88 (5.0)

0.70 (4.00)

0.88 (5.0)

0.70 (4.00)

 

2.4.8.3

1. After Thermal Stress

 

 

 

 

 

 

2. At 125°C [257 F]

 

 

 

 

 

 

3. After Process Solutions

1.23 (7.0)

0.80 (4.57)

1.40 (8.0)

1.05 (6.00)

 

 

 

1.05 (6.0)

0.70 (4.00)

1.23 (7.0)

0.70 (4.00)

 

 

 

1.05 (6.0)

0.55 (3.14)

1.23 (7.0)

0.80 (4.57)

 

 

Volume Resistivity, minimum

 

 

 

 

MW-cm

2.5.17.1

A. C-96/35/90

3.0x1010

106

--

--

B. After moisture resistance

--

--

3.0x1010

104

C. At elevated temperature E-24/125

5.0x1010

103

1.0x1010

103

Surface Resistivity, minimum

 

 

 

 

MW

2.5.17.1

A. C-96/35/90

3.0x1010

104

--

--

B. After moisture resistance

--

--

3.0x1010

104

C. At elevated temperature E-24/125

4.0x1010

103

4.0x1010

103

Moisture Absorption, maximum

--

--

0.12

0.8

%

2.6.2.1

Dielectric Breakdown, minimum

--

--

60

40

kV

2.5.6

Permittivity (Dk, 50% resin content)

 

5.4

 

5.4

--

 

(Laminate & Laminated Prepreg)

 

 

 

A. 1MHz

4.4

4.4

2.5.5.9

B. 1GHz

4.4

4.4

 

C. 2GHz

4.2

4.3

2.5.5.13

D. 5GHz

4.1

4.1

 

E. 10GHz

4

4.1

 

Loss Tangent (Df, 50% resin content)

 

0.035

 

0.035

--

 

(Laminate & Laminated Prepreg)

 

 

 

A. 1MHz

0.015

0.014

2.5.5.9

B. 1GHz

0.015

0.015

 

C. 2GHz

0.015

0.015

2.5.5.13

D. 5GHz

0.016

0.016

 

E. 10GHz

0.017

0.016

 

Flexural Strength, minimum

 

 

 

 

N/mm2

2.4.4

A. Length direction

--

--

500-530

415

(lb/in2)

 

--

--

(72,500-76,850)

-60,190

 

B. Cross direction

--

--

410-440

345

 

 

--

--

(59,450-63,800)

-50,140

 

Arc Resistance, minimum

125

60

125

60

s

2.5.1

Thermal Stress 10 s at 288°C [550.4F],minimum

 

 

 

 

Rating

2.4.13.1

A. Unetched

Pass

Pass Visual

Pass

Pass Visual

B. Etched

Pass

Pass Visual

Pass

Pass Visual

Electric Strength, minimum

45

30

--

--

kV/mm

2.5.6.2

(Laminate & Laminated Prepreg)

Flammability,

V-0

V-0

V-0

V-0

Rating

UL94

(Laminate & Laminated Prepreg)

Glass Transition Temperature(DSC)

175

170 minimum

175

170 minimum

˚C

2.4.25

Decomposition Temperature

--

--

345

340 minimum

˚C

2.4.24.6

(5% wt loss)

X/Y Axis CTE (40℃ to 125℃)

--

--

10--13

--

PPM/˚C

2.4.24

Z-Axis CTE

 

 

 

 

 

2.4.24

A. Alpha 1

--

--

45

60 maximum

PPM/˚C

B. Alpha 2

--

--

210

300 maximum

PPM/˚C

C. 50 to 260 Degrees C

--

--

2.7

3.0 maximum

%

Thermal Resistance

 

 

 

 

 

2.4.24.1

A. T260

--

--

>60

30 minimum

Minutes

B. T288

--

--

>30

15 minimum

Minutes

CAF Resistance

--

--

Pass

AABUS

Pass/Fail

2.6.25

We are one of the professional fr 4 high tg pcb red soldermask 3 microinch gold for system integration manufacturers and suppliers in China, offering the best services and the highest quality solutions for you. Please rest assured to get the high quality products made in China from our factory.

Inquiry