HDI PCBs with 1.6mm 8Layers 1.6mm and Buried and Blind Vias Holes

HDI PCBs with 1.6mm, 8Layers; Buried and Blind vias holes

Product Details

2)HDI PCBs with 1.6mm, 8Layers; Buried and Blind vias holes


LAYER COUNT: 8

MATERIAL TYPE: FR-4 TG170

BOARD THICKNESS: 1.6MM+/-10%

FINISHED COPPER: 1OZ

MIN HOLE SIZE: 0.3MM

HOLE WAL COPPER: ≥25UM

TRACE WIDTH/SPACE: MIN 4/4MIL

SOLDERMASK TYPE: Green

SURFACE FINISH: ENIG


Typical Specifications

Layers

1-10

Materials

FR-4 TG170

Maximal Size

500mm x 600mm

Board Size Tolerance

±0.2mm

Board Thickness

0.4 – 7mm

Board Thickness Tolerance

±10% (t>1mm)
0.1mm (t<1mm)

Finished Copper Thickness

0.5 – 7oz

Min. Trace/Space

3mil

Minimum Via Monolateral Welding Ring

6mil (0.153mm)

Non-plated Through Holes

Yes

Internal Cutout

Yes

Minimum Hole Size

4mil (0.1mm)

Finished Hole Size Tolerance

±2mil (±0.05mm)

Minimum Character Width (Legend)

0.15mm

Minimum Character Height (Legend)

0.8mm

Routing to Board Edge Clearance

12mil (0.3mm)

Surface Finish

HASL with lead
HASL lead free
Immersion gold

Solder Mask Type

LPI

Solder Mask Color

Green
Red
Yellow
Blue

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