HDI PCBs with 1.6mm, 8Layers; Buried and Blind vias holes
HDI PCBs with 1.6mm, 8Layers; Buried and Blind vias holes
LAYER COUNT: 8
MATERIAL TYPE: FR-4 TG170
BOARD THICKNESS: 1.6MM+/-10%
FINISHED COPPER: 1OZ
MIN HOLE SIZE: 0.3MM
HOLE WAL COPPER: ≥25UM
TRACE WIDTH/SPACE: MIN 4/4MIL
SOLDERMASK TYPE: Green
SURFACE FINISH: ENIG
Typical Specifications | |
Layers | 1-10 |
Materials | FR-4 TG170 |
Maximal Size | 500mm x 600mm |
Board Size Tolerance | ±0.2mm |
Board Thickness | 0.4 – 7mm |
Board Thickness Tolerance | ±10% (t>1mm) |
Finished Copper Thickness | 0.5 – 7oz |
Min. Trace/Space | 3mil |
Minimum Via Monolateral Welding Ring | 6mil (0.153mm) |
Non-plated Through Holes | Yes |
Internal Cutout | Yes |
Minimum Hole Size | 4mil (0.1mm) |
Finished Hole Size Tolerance | ±2mil (±0.05mm) |
Minimum Character Width (Legend) | 0.15mm |
Minimum Character Height (Legend) | 0.8mm |
Routing to Board Edge Clearance | 12mil (0.3mm) |
Surface Finish | HASL with lead |
Solder Mask Type | LPI |
Solder Mask Color | Green |
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