Key Specifications/Special Features: 16 layer, size 274X194.5mm, 1pc/array, material EM827，2.3mm thick, 1&H OZ copper on inner layers, 1OZ copper on external layers, ENIG surface finish， green solder mask, 5.0/5.0mil min w/s(line width/spacing), min PTH hole 0.30mm. Specially there is depth...
HDI Of 16 Layers Key Specifications/Special Features:
16 layer, size 274X194.5mm, 1pc/array, material EM827，2.3mm thick, 1&H OZ copper on inner layers, 1OZ copper on external layers, ENIG surface finish， green solder mask, 5.0/5.0mil min w/s(line width/spacing), min PTH hole 0.30mm. Specially there is depth mill (0.1mm deep) done by Laser. With countersink holes in the blind mill area. IPC clas3 standard.
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