8 layers HDI with 2 mil track width/space and 0.1mm laser hole
5) 8 layers HDI with 2 mil track width/space and 0.1mm laser hole
LAYER COUNT: 8
MATERIAL TYPE: FR-4 TG 130
BOARD THICKNESS: 1.0MM+/-10%
FINISHED COPPER: 1OZ
MIN HOLE SIZE: 0.1MM
HOLE WAL COPPER: ≥25UM
TRACE WIDTH/SPACE: MIN 2/2MIL
SOLDERMASK TYPE: Green
HDI boards, one of the fastest growing technologies in PCBs, are now available at Epec. HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
There are 6 different types of HDI boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constructions of coreless constructions using layer pairs.
·1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.
·i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in challenging designs.
·Any Layer HDI - All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.
Advanced Capabilities: Microvias
A microvia maintains a laser drilled diameter of typically 0.006" (150µm), 0.005" (125µm), or 0.004" (100µm), which are optically aligned and require a pad diameter typically 0.012" (300µm), 0.010" (250µm), or 0.008" (200µm), allowing additional routing density. Microvias can be via-in-pad, offset, staggered or stacked, non-conductive filled and copper plated over the top or solid copper filled or plated. Microvias add value when routing out of fine pitch BGAs such as 0.8 mm pitch devices and below.
Additionally, microvias add value when routing out of a 0.5 mm pitch device where staggered microvias can be used, however, routing micro-BGAs such as 0.4 mm, 0.3 mm, or 0.25 mm pitch device, requires the use of Stacked MicroVias® using an inverted pyramid routing technique.
TTM maintains years of experience with HDI products and was a pioneer of second generation microvias or Stacked MicroVias (SMV®). SMV® Technology offers solid copper stacked microvias providing rout-out solutions for micro BGAs.
TTM developed and now offer an entire family of microvia technology solutions for your next generation products.
The list below shows TTM's entire family of Microvia Technology.
We are one of the professional 8 layers hdi with 2 mil track width/space and 0.1mm laser hole manufacturers and suppliers in China, offering the best services and the highest quality solutions for you. Please rest assured to get the high quality products made in China from our factory.