HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area.
HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products. This includes touch screen computing, 4G network communications and military applications such as avionics and smart munitions.
HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today's large pin-count chips utilized in mobile devices and other high technology products.
1）6 layers 2.0mm HDI PCBs with TG175 mm
LAYER COUNT: 6
MATERIAL TYPE: FR-4 TG175
BOARD THICKNESS: 2.0MM+/-10%
FINISHED COPPER: 2OZ
MIN HOLE SIZE: 0.3MM
HOLE WAL COPPER: ≥25UM
TRACE WIDTH/SPACE: MIN 8/8MIL
SOLDERMASK TYPE: Green
SURFACE FINISH: ENIG
This stack-up includes:
·The use of a 12/5 (.012”pad/.005” laser drill) stacked micro-vias.
·An 18/8 buried-via from layers 4-13.
·A 24/12 thru-hole-via from layers 1-16.
·Solid ground plane on layers 2, 5, 8, 11 & 15.
·Power planes on layer 3, 6, 9, 12 & 14.
·Buried capacitance materials for layer pairs 5/6, 8/9 and 11/12.
·Signal breakout traces on layers 1, 3, 4, 13, 14 & 16.
·Primary signal routing on layers 4, 7, 10 & 13.
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