10 layers HDI with Ying Yang copper and ENIG
4. 10 layers HDI with Ying Yang copper and ENIG
·Multilayer copper filled stacked micro via structure
·1.2/1.2 mil line/space
·4/8 mil laser via capture pad size
oHigh temperature FR4
oHalogen - Free
oHigh Speed (low loss)
All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures ("any layer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices.
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