Key Specifications/Special Features: Specifications: Material: FR4 TG170 Layer count: 12 layers Board thickness: 1.6mm Copper thickness: 1oz Minimum drill size: 0.1mm Minimum trace & gap: 0.1mm Surface finish: immersion gold Special technology: blind and buried via Via in pad plugged &...
Specifications:
Material: FR4 TG170
Layer count: 12 layers
Board thickness: 1.6mm
Copper thickness: 1oz
Minimum drill size: 0.1mm
Minimum trace & gap: 0.1mm
Surface finish: immersion gold
Special technology: blind and buried via
Via in pad plugged & plated shut, stacked vias
Blind drill: layer 1-2, 2-3, 3-10, 10-11, 11-12
Applications: industry control
Asia
Australasia
Central/South America
Eastern Europe
Mid East/Africa
North America
Western Europe
FOB Port:Shenzhen
Lead Time:5 - 15 days