Double PCBs With Black Solder mask; Hot Air Solder Leveling or OSP; 8mil Vias
2)Double PCBs With Black Solder mask; Hot Air Solder Leveling or OSP; 8mil Vias
LAYER COUNT: 2
MATERIAL TYPE: FR-4 TG130
BOARD THICKNESS: 1.2+/-0.1MM
FINISHED COPPER: 1OZ
MIN HOLE SIZE: 0.2MM
HOLE WAL COPPER: ≥20um
TRACE WIDTH/SPACE: MIN 4/4MIL
SOLDERMASK TYPE: Black
SURFACE FINISH: OSP
Benefits of Double Sided PCBs:
• More flexibility for designers
• Increased circuit density
• Relatively lower costs
• Intermediate level of circuit complexity
• Reduced board size (which can reduce costs)
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