Double PCBs with Black Solder Mask Hot Air Solder Leveling or OSP and 8mil Vias

2）Double PCBs With Black Solder mask; Hot Air Solder Leveling or OSP; 8mil Vias

LAYER COUNT: 2

MATERIAL TYPE:  FR-4 TG130

BOARD THICKNESS: 1.2+/-0.1MM

FINISHED COPPER: 1OZ

MIN HOLE SIZE: 0.2MM

HOLE WAL COPPER: ≥20um

TRACE WIDTH/SPACE: MIN 4/4MIL

SOLDERMASK TYPE: Black

SURFACE FINISH: OSP

Benefits of Double Sided PCBs:

• More flexibility for designers

• Increased circuit density

• Relatively lower costs

• Intermediate level of circuit complexity

• Reduced board size (which can reduce costs)

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