4 Layers auto rigid flex PCB with balck soldermask color and shielding material

Max panel size

32” x 20.5”(800mm x 520mm)

Min track width/space

2mil/2mil(50um/50um)

Min pad

5 mil(0.13mm)

Pad?annular

Min inner layer thickness

4 mil(0.1mm)

No Cu Clad

Inner layer copper thickness

1~4 oz

Outer layer copper thickness

0.5~6 oz

Finished board thickness

0.4-3.2 mm

Tolerance of finished board thickness

thickness<1.0mm

±0.10 mm

4~8?layers

1.0mm<thickness<2.0mm

±10%

4~12layers

thickness>=2.0mm

±10%

≥12 layers

Inner layer surface finishing

Brown-Oxidation

Layer count

2~28

Layers Registration

±4mil/±1.25mil

Min hole-drilling size

0.20 mm

Min finished hole size

0.15 mm

Hole position accuracy

±2 mil(±50 um)

Slot Tolerance

±2 mil(±50 um)

PTH Tolerance

±1 mil(±25um）

NPTH Tolerance

±1mil(±25um)

Max PTH A.R.

12:1

Hole Wall thickness

10-50um

Outer layer image tolerance

3mil/3mil

Min Outer layer track width/space

3mil/3mil

Etching tolerance

10%

SM thickness

Line end

0.4-1.2mil(10-30um)

Line?corner

≥0.2mil(5um)

On substrate

≤Finished Cu thickness +1.2mail

SM hardness

6H

SM registration tolerance

±2mil(+_50um)

Min SM dam

3.0mil(75um)

Max hole-plugging size

0.70mil

Surface Finishing

HASL、Golder-finger、Au Panel、OSP、ENIG

Max nickel thickness for gold finger

280u"(7um)

Max gold thickness for gold finger

30mil(0.75mm)

Range of nickel thickness for electroless nickel and immersion gold

120u"/240u"(3um/6um)

Range of gold thickness for electroless nickel and immersion gold

2u"/6u"(0.05um/0.15um)

Impedance control and tolerance

50 ±10%,75%±10%，100±10%

Peel strength of line

≥61B/in(≥107g/mm)