4 layers 1.0mm thickness rigid flex with small IC and immersion gold
4 layers 1.0mm thickness rigid flex with small IC and immersion gold
Material: FR-4+PI
Layers(R+F):2+2 layers
Thickness:0.2mm+0.8mm
Min holes:0.2 mm
Min line/space:6 / 6mil
Impedance: No
Surface treatment:Immersion gold
Shebei group ability for Rigid-flex:
Specifications | Technology |
Base Material | Polyimide(PI), Polyester(PET) |
Stiffener Material | Polyimide / FR4 / Metal |
Layers | FPC:1-6 Layers |
Board Thickness | FPC:0.05-2.5mm |
Max / Min Board Size | Min: 0.2"x0.3" Max: 20.5"x13" |
Min line width/space | 0.04/0.04mm |
Min Through Hole Size | 0.2mm |
Minimum Trace/Space | 0.0015″/.002″ (0.33 oz.) |
Minimum Via Hole Diameter | 0.006″ (NC Drill) |
Minimum Blind Via Diameter | 0.004″ (UV Laser) |
Trace to Edge Distance | 0.010″ ( NC Route ) |
Trace to Edge Tolerance | 0.005″ ( NC Route ) |
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