4 layers 1.0mm thickness rigid flex PCB with small IC and immersion Gold

​4 layers 1.0mm thickness rigid flex with small IC and immersion gold

Product Details

4 layers 1.0mm thickness rigid flex with small IC and immersion gold

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Material: FR-4+PI

Layers(R+F):2+2 layers

Thickness:0.2mm+0.8mm

Min holes:0.2 mm

Min line/space:6 / 6mil

Impedance: No

Surface treatment:Immersion gold


Shebei group ability for Rigid-flex:

Specifications

Technology

Base Material

Polyimide(PI), Polyester(PET)

Stiffener Material

Polyimide / FR4 / Metal

Layers

FPC:1-6 Layers
Rigid-Flex:2-10 Layers

Board Thickness

FPC:0.05-2.5mm
Rigid-Flex:0.06-4.0mm

Max / Min Board Size

Min: 0.2"x0.3" Max: 20.5"x13"

Min line width/space

0.04/0.04mm

Min Through Hole Size

0.2mm

Minimum Trace/Space

0.0015″/.002″ (0.33 oz.)
0.002″/.0025″ (0.5 oz.)
0.003″/.0035″ (1 oz.)

Minimum Via Hole Diameter

0.006″ (NC Drill)
0.002″ (UV Laser)

Minimum Blind Via Diameter

0.004″ (UV Laser)

Trace to Edge Distance

0.010″ ( NC Route )
0.008″ (Die Punch)

Trace to Edge Tolerance

0.005″ ( NC Route )
0.003″ (Die Punch)
0.001″ (UV Laser)

We are one of the professional 4 layers 1.0mm thickness rigid flex pcb with small ic and immersion gold manufacturers and suppliers in China, offering the best services and the highest quality solutions for you. Please rest assured to get the high quality products made in China from our factory.

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