Flat Non-standard Series Patch Power Inductor

High intensity emission of lateral magnetic field lines; Flat sticker product form is suitable for use in ultra-thin electronic product structure; Four PAD structure design, very good balance product structure; This kind of inductance chip mass production difficulty decreases, the accuracy enhancement; Surface mount reflow soldering.

Product Details

Flat Non-standard Series Patch Power Inductor:

Product realization manufacturing process:

  PCB  manufacturing  process combining Rigid and Flex。

 

●Product application:

Mobile phone, tablet computer, nfc-bluetooth headset;

Wristband, smart watch;

Multi-function smart card (nfc-sim card, VIP visual standard card, bluetooth standard card

● Product attributes -- external dimensions:


 

 

 

 

 

 

Unit:mm

 


P/N

A

B

C

D

E

F

G

H

I

J

K

P060MQ0234B1

11.20±0.15

6.50±0.15

0.45±0.1

0.48

1.60

6.10

11.10

1.70

1.00

6.20

12.1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

●Product attributes - electrical performance parameters(一):

P/N

Lp(uH)

Tolerance

Q

Test  level/impedance

The test  frequency

DCR(Ω)Max

P060MQ0234B1

4.7

30%

0.71

1V/100Ω

100kHz

1.6

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

●Product attributes - electrical performance parameters(二):

P/N

L(uH)

Tolerance

 Test frequency

Dc  resistance (Ω)Max

P060MQ0234B1

1.68

10%

13.56MHz

1.55Ω

 

 

 

 

 

 

 

 

 

 

 

●Product attributes -- flat structural unit diagrams:

 

 

 

 

 

 


●Product attributes – stack-up:

 

 

 

 

 

 

 


★Other value-added services: Can provide customized product design and development, product manufacturing, product performance evaluation.

Brief introduction:
Chip inductors are directly used for hybrid integrated circuits (HIC) mounting from multilayer ceramic dielectric containers with leads.As early as the 1960s, JDI and Sprague began production in the United States.In 1977, panasonic of Japan used SMT, SMC and SMD processes in consumer electronic products such as ultra-thin semiconductor radios.
In order to meet SMT needs, chip inductor research and development began, and soon realized industrialization.
"Chip inductor" is the name of inductor structure classification.According to the classification of structure and manufacturing process, inductors are divided into two categories: cartridge type stereoscopic inductor and stick type chip inductor. The main manufacturing technology of traditional cartridge inductor is "winding", that is, the wire is wound around the magnetic core to form inductor coil (also common hollow coil).This inductor is characterized by a wide range of inductance, high accuracy of inductance value, high power, small loss, simple manufacturing, short production cycle, adequate supply of raw materials, disadvantages are low degree of automation production, high production cost, difficult to small lightweight. 
classification
Chip inductors are divided into four types from the manufacturing process, namely winding type, laminated type, braided type and thin film type inductors.Among them, winding inductor is the traditional winding inductor miniaturization product, laminated type is the use of multi-layer printing technology and laminated production process, volume than winding type chip inductor is smaller, is the inductor field of key development of the product.Chip inductor current situation and trend of development as the micro inductor to achieve enough inductance and quality factor (Q) is more difficult, at the same time due to the magnetic components in the circuit and magnetic circuit intertwined, production process is complicated, look for one of the three basic passive components of inductor chip, obviously lagging behind the capacitor and resistor.

 



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