Metal PCB is the most widely used aluminum-based CCL, the product was invented by the Japanese Sanyo National Policy in 1969, 1974 began to be used in STK series power amplifier hybrid integrated circuits. The early 80s China's metal-based CCL is mainly used in military products, when the metal PCB substrate material completely dependent on imports, expensive. In the late 1980s, with the extensive use and expansion of aluminum-based CCL in automobile and motorcycle electronic products, the development of metal PCB substrate research and manufacturing technology and its application in the fields of electronics, telecommunications, Metal PCB power and so on The wide range of applications.
At present, China's metal PCB substrate market is expanding year by year, many foreign electronic assembly manufacturers have also invested in domestic construction, only the Pearl River Delta region aluminum-based CCL demand for about a thousand square meters per month, the domestic monthly demand of about For the 2000-3000m2, Metal PCB its market prospects are very good.
Metal PCB substrate characteristics and application areas
Metal PCB substrate is made of metal substrate (such as aluminum, copper, iron, silicon steel), high thermal insulation dielectric layer and copper foil composition. Insulating dielectric layer is generally made of high thermal conductivity of epoxy glass cloth adhesive sheet or high thermal conductivity of epoxy resin, insulation medium layer thickness of 80μm-100μm, metal plate thickness specifications for the 0.5 mm, 1.0mm, 1. 5 mm, 2.0 ma, 3.0 mm. Various metal substrate characteristics and application areas:
Iron-based CCL and silicon steel CCL have excellent electrical properties, magnetic permeability, pressure, substrate strength. Mainly used for brushless DC motor, tape recorders, Metal PCB included machine with a spindle motor and intelligent drive. But the silicon steel CCL is superior to iron-based CCL; copper-based CCL with aluminum-based CCL basic performance, the heat dissipation is better than aluminum-based CCL, the substrate can carry high current for the manufacture of power electronics and Automotive electronics and other high-power circuit with PCB, Metal PCB but the copper substrate density, high value, easy to oxidation, so that its application is limited, the amount is much lower than the aluminum-based CCL. </ P>
Aluminum-based CCL has excellent electrical performance, heat dissipation, electromagnetic shielding, high pressure and bending plus q-, can be used mainly for automobiles, motorcycles, computers, home appliances, communications electronics, power electronics products. Metal PCB substrate in the aluminum-based CCL the largest market, the application examples are as follows.
Automotive power supply: power supply regulator, ignition device, voltage regulator, power supply, power supply, power supply, Components: power supply, floppy drive, CPU; power supply; switch regulator, switch, DC-DC converter, regulator, regulator, DC-AC converter, large power supply, solar power supply board; Telephone, mobile phone high frequency booster, filter circuit, sending circuit; electronic control: relay, transistor base; switch; radiator, Metal PCB semiconductor device insulation thermal conductivity board, motor controller; other: IC chip carrier, air regulator.
Development Trend of Metal PCB Substrate
With the development of electronic technology, the market demand for aluminum-based CCL is heating up, while the technical requirements for metal PCB substrate is also getting higher and higher, can be summarized as the following aspects:
A. The thermal conductivity of metal PCB substrate requirements higher;
B. Aluminum clad laminate is required to withstand higher breakdown voltages, requiring a maximum breakdown voltage of up to 15 kV (DC, AC). The 704 plant has been able to provide pressure resistant to 8 kV (AC) and 10 kV (DC) Copper cladding
C. Aluminum plate to the multi-layer development, the demand for high thermal conductivity of aluminum-based CCL sheet and supporting the thermal film.
5. Standard for metal PCB substrates
So far, foreign has not yet developed a technical standard for metal PCB substrate, so the foreign production plant metal PCB substrate product standard index system, Metal PCB test conditions, test methods, environmental test project there is a big difference. Before 1995, the metal PCB substrate heat dissipation at home and abroad there is no uniform assessment and testing standards, some with thermal resistance to say that some with thermal conductivity to represent.
Domestic and foreign metal PCB substrate production plants have used their own methods to detect and assess the product heat dissipation.