So-called solder is to soak the circuit board to dissolve in melting tin-lead, when after the circuit board surface with a sufficient number of Sn-Pb, reusing hot air pressure the excess tin-lead shaving. After cooling tin-lead soldering area is coated with a layer of the appropriate thickness of Tin, lead, this is the General procedure of HASL process. PCB surface treatment technology, the current application is the most HASL process, also known as hot air leveling technique, is sprayed with a layer of Tin on the pad to increase PCB pad conduction properties and weldability. Spray Tin SMOBC&HAL) treated as a PCB Board of one of the most common forms of surface coating, is widely used to produce lines, solder directly affects the quality of subsequent production welding soldering quality and solderability; quality of solder circuit board manufacturers quality control a priority. For the average two-panel, HASL, OSP process used most, and rosin on a technology widely used in single-sided PCB, gold plating process in applications requiring bonding IC on the circuit board. Gold is far more on card-board application.
In the usual surface treatment of PCB, HASL process known as best weldability, because Tin pads, when welding on the Tin, with Rosin and OSP, gold-plated Board or process is somewhat easier. This manual for us, is very easy to reach on the Tin, welding non-fame easily.