|Multilayer rigid - flexible PCB manufacturing solutions|
|PN：||Multilayer rigid - flexible PCB||Project function type：||Device component support carrier|
|The core base material||Material specification：||FR4/BT、PI|
|Auxiliary materials||Material specification：||PI\FR4\steel stiffener、Double sided tape|
|Min thickness：||0.2mm||CNC Min hole：||0.2mm|
|Min trace：||3mil||Min spacing：||3mil|
|Insulation resistance welding：||photosensitive ink、PI cover||silk technology：||Multicolor character ink|
|Special packaging：||BGA、COB,etc||Surface treatment：||ENIG、Pltaed gold、HASL、OSP etc|
|Special technology||Materials technology：||The substrate material takes into account bending strength, impact strength, water absorption, material density, combustibility, pressure plate melting point, high resistance to chemical change, thermoplastic, resistance to drug, abrasion and dimensional stability;Electrical strength, breakdown voltage, dielectric constant, loss factor, etc.|
|Manufacturing technology：||Special process: blind hole, buried hole, micro hole, cross blind hole, HDI of any order, various surface processes/inks on the same surface, etc.;Special structure: laminated symmetrical/asymmetrical combination of soft and hard, suspended soft plate area, double-layer/three-layer/four-layer/six-layer soft plate structure.|
|Microelectronics technology||Materials technology：||Special (substrate, thermosetting ink, photosensitive ink, silver oil, carbon oil, copper paste, stable performance of the coating adhesive) material;|
Part of multi-layer rigid-flexible PCB inner layer shall be embedded with special materials or devices;
Part of the multi-layer rigid-flexible combined circuit board special chip packaging form (BGA, COB, etc.) before pasting the circuit board special design and manufacture;
Special treatment for high density PCB etching.
|Hardware electronic||Multi-layer rigid-flexible combined circuit board (MFPC) mostly ACTS as the device component/circuit connection support carrier in the electronic circuit hardware technology environment;A few multilayer rigid-flexible combined circuit boards can be used as LCR devices (such as carbon-oil bridge variable resistor, parallel plate capacitor, coil inductor, etc.);Part of the multi-layer rigid-flexible circuit board simulation anti-static ESD, anti-interference EMI, resonance, transformer, high-frequency signal transmission circuit.|
|Available product design|
Can provide electronic circuit schematic design, PCB wiring design, functional test fixture design;
Can provide manufacturability design, PCB-CAM design.
|Core manufacturing process||Drilling/decontamination, lamination, electroplating copper, graphic transfer, molding and other processes.|
|Core QC engineering proces||Substrate material IQC inspection, drilling decontamination first inspection, pressing first inspection, graphic transfer inspection, molding inspection.|
|Finished functional test|
Function test of circuit opening and short-circuit;Some products need to test the functional fixture of analog circuit;
Line defect functional test.
|Finished product reliability test|
Salt spray test optional;
Thermal shock test, weldability test, etc.
|Product certification||3C certification, UL certification, etc.|
|The product application||Portable terminal equipment, multi-functional integrated parts module, other compressed space electronic equipment, etc. (such as handheld mobile terminals).|
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