|Multilayer rigid circuit board manufacturing solutions|
|PN：||Multilayer rigid circuit board||Type：||Device component support carrier|
|The core base material||Material specification：||FR4、BT、Ceramic, Teflon, ptfe, etc|
|Auxiliary materials||Material specification||\|
|Min thickness：||0.15mm||Min hole：||0.1mm|
|Min trace：||3mil||Min spacing：||3mil|
|Insulation resistance welding：||Thermosetting/photosensitive ink (multiple colors)||silk technology：||Multicolor character ink|
|Special packaging：||Multiple packaging forms||Surface treatment：||ENIG、Pltaed gold、HASL、OSP etc|
|Special technology||Materials technology：|
Part of the rigid circuit board shall consider the bending strength of the vertical layer of the substrate material, impact strength of the parallel layer, water absorption,
Material density, combustibility, melting point of pressure plate, high chemical resistance, thermoplasticity, resistance to drug, abrasion and dimensional stability;
Part of the rigid circuit board needs to consider the material vertical layer to electrical strength, parallel layer to breakdown voltage, specific frequency point（50HZ\1MHZ\13.56MHZ\915MHZ\2.4GHZ\5GHZ\10GHZ）Relative dielectric constant and loss factor.
Special processes: blind hole, buried hole, micro hole, cross blind hole, any order HDI, same surface multiple surface processes/ink, etc.
|Microelectronics technology||Materials technology：||Special (substrate, thermosetting ink, photosensitive ink, silver oil, carbon oil, copper paste, stable performance of the coating adhesive) material;|
Part of the multi-layer rigid circuit board inner layer needs to be embedded with special materials or special devices;
Part of the multilayer rigid circuit board special chip packaging form (BGA, COB, etc.) before pasting the circuit board special design and manufacture;
Special treatment for high density PCB etching.
Multilayer rigid circuit boards mostly act as component/circuit connection support carrier in electronic circuit hardware technology environment;
A few multilayer rigid circuit boards can be used as LCR devices (such as variable carbon-oil bridge resistors, parallel plate capacitors, coil inductors, etc.);
Some multilayer rigid circuit boards use differential circuit to design MESH safety circuit.
Some multilayer rigid circuit boards simulate anti-static ESD, anti-interference EMI, resonance, transformer, high-frequency signal transmission circuit.
|Available product design|
Can provide electronic circuit schematic design, PCB wiring design, functional test fixture design;
Can provide manufacturability design, PCB-CAM design.
|Core manufacturing process||It is very important to transfer electrodeposited copper and graphics in wet process.The lamination of dry process is very important.|
|Core QC engineering process||Substrate material IQC inspection, line graphic transfer/etching first inspection, lamination first inspection, surface technology first inspection.|
|Finished functional test|
Function test of circuit opening and short-circuit;Some products need to test the functional fixture of analog circuit;
Line defect functional test;
|Finished product reliability test|
Salt spray test optional;
Thermal shock test, weldability test, etc.
|Product certification||3C certification, UL certification, etc.|
|The product application||Portable terminal equipment, multi-functional integrated parts module,|
other compressed space electronic equipment, etc. (such as handheld mobile terminals).