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Microelectronic circuit board solution
PN:Microelectronic PCBProject function type:Microdevice/module support carrier
The core base materialMaterial   specification:BT resin、FR4、PI、coating material, filling materialJ0Q%@9IZRAAD51UUJB[@5S7
Brand:\PN:\
Auxiliary materialsMaterial specificationStiffener、Adhesive paper, anti-interference material, shielding film
Brand:\PN:\
size:ODMLayers:1-12 layers
Min thickness:0.06mmMin hole:0.2mm
Min trace:2.5milMin spacing:2.5mil

photosensitive ink/PI coversilk technology:Multicolor   character ink
Special   packaging:\Surface   treatment:ENIG、Pltaed gold、HASL、OSP etc.
Stack-up:ODM
Conventional manufacturing   technologyMaterials   technology:Substrates often need to consider vertical layer to electrical   strength, parallel layer to breakdown voltage, specific frequency point (50HZ\1MHZ\ 13.56mhz \915MHZ\ 2.4ghz \5GHZ\10GHZ) relative dielectric constant and loss factor, insulation resistance and other electrical properties;Water absorption, dimensional stability and other physical and mechanical properties.
Manufacturing technology:Blind hole, buried hole, micro hole, cross blind hole, HDI of any order, various surface processes/inks on the same surface, other coating materials, etc.
Hardware electronicsSome PCB products and the whole PCBA module may consider hardware electronic technology.
Microelectronics technologyManufacturing technology:Special (substrate material, ink) material to ensure smooth, small shrinkage deformation, wear resistance, compression resistance, seismic, impact resistance and other functions.
Functional requirements auxiliary materialsSpecial (filling material, coating material, ink) material breakthrough bypass conduction, isolation shielding, insulation breakdown prevention and other functions.
Microdevice support carrier manufacturing processSpecial manufacturing process and surface technology to ensure the micro device packaging processing quality yield improvement.
Manufacturing process of micromodule support carrierSpecial manufacturing process and surface process ensure that the micro module paste processing quality yield improvement and structural parts assembly yield improvement.
Available product design

Hardware electronic design, electronic circuit schematic design, PCB wiring design, functional test fixture design;

Manufacturability design, PCB-CAM design.

Core manufacturing processCircuit board immersed copper, circuit etching, graphic transfer, characteristic coating material coating, functional testing.
Core QC engineering processSubstrate material IQC inspection, line pattern transfer/etching first inspection, lamination first inspection, material coating first inspection, surface technology first inspection.
Finished   functional test

Function test of circuit opening and short-circuit;Function fixture test of simulator/analog circuit;

Line defect functional test.

Finished product reliability testSalt spray test optional;Thermal shock test, weldability test, etc.
Product certification3C certification, UL certification, etc.
The product applicationApplication scenarios: narrow space, strict requirements for smoothness, cold/heat/tension/moisture resistance, certain flexibility;

Terminal equipment: car door and window controller, dashboard panel, SD card, usb KEY, multi-function card, other IC boards, etc.