4 Layers 0.45mm thickness and 1.5 OZ copper flexible circuit board with 3 mil line and space

4 layers 0.45mm thickness and 1.5 OZ copper flexible circuit board with 3 mil line and space

Dielectric: Pi

Material: Fiberglass Epoxy Resin + Polyimide Resin

Application: Consumer Electronics

Flame Retardant Properties: V0

Mechanical Rigid: Fexible

Processing Technology: Electrolytic Foil

Base Material: Copper     Insulation Materials: Epoxy Resin

Certificate: RoHS; UL ; Ts16949 ; ISO9001:ISO14001  Specification: RoHS, UL, ISO

Flex circuits having three or more layers of conductors are known as multilayer flex circuits. Commonly the layers are interconnected by means of plated through holes, though this is not a requirement of the definition for it is possible to provide openings to access lower circuit level features. The layers of the multilayer flex circuit may or may not be continuously laminated together throughout the construction with the obvious exception of the areas occupied by plated through-holes. The practice of discontinuous lamination is common in cases where maximum flexibility is required. This is accomplished by leaving unbonded the areas where flexing or bending is to occur.

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