Multi-Layer flexible circuit is a combination of single or double laminated with thermoset adhesive onto a single and/or double-sided FR-4 clad material.
0.5 mm 4 layers FPC with black cover film and immersion gold process and 510mm long size
Materials: CEM1, CEM3, Teflon, Rogers,FR-4, High Tg FR-4, Aluminum Base, Halogen Free
Max. Board Size: 510*1200mm
Material: RoHS Directive-compliant
PCB thickness: 0.28 mm
Out Layer Copper Thickness: 1oz
Inner Layer Copper Thickness: 1/2oz-5oz
Max. board Thickness: 6.0mm
Multi-Layer flexible circuit is a combination of single or double laminated with thermoset adhesive onto a single and/or double-sided FR-4 clad material. Three or more flexible conductive layers with flexible insulating layers between each one, which are interconnected by way of plated through holes (PTH). Layers range from 1 to 8 layers in the flex area and up to 10 layers in the rigid area.
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